Five Production Steps of LED Lighting
Since electrical lighting produced, lighting is divided into three times: filament bulb era (incandescent), gas lamp (fluorescent lamp), semiconductor light era (LED). Incandescent light bulbs, with the longest history, and LED lighting will be the future lighting mainstream. Regard on incandescent and LED, you will find that, the lighting industry production work flow, China is in the downstream of the industry. Core technology is having in Europe, United States and Japan.
1, LED lighting principle, it is electronic through the layers of semiconductor materials, stimulate the semiconductor materials convert electrical energy into light energy. Single semiconductor lighting ability is weak, so will a lot of single layer material stack up, this is “epitaxial slice”.
LED luminous efficiency depends on, in the same thickness how many layers can be pumped. The thinnersingle layer, the more higher luminous efficiency. Now every layer thickness is only 2-20 microns. Epitaxial wafer production is the most intractable part of the LED manufacturing process.
LED luminous efficiency depends on, in the same thickness how many layers can be pumped. The thinnersingle layer, the more higher luminous efficiency. Now every layer thickness is only 2-20 microns. Epitaxial wafer production is the most intractable part of the LED manufacturing process.
2, Cutting – LED core technology: It is like extracting filament from tungsten material. The difference is cutting the epitaxial wafer is a square shape.
As the special structure of epitaxial slice, to cut off light intact core, it is very difficult. Not only requires a vacuum environment, but also the professional cutting machine. At present, there are few manufacturers can make this cutting machine.
As the special structure of epitaxial slice, to cut off light intact core, it is very difficult. Not only requires a vacuum environment, but also the professional cutting machine. At present, there are few manufacturers can make this cutting machine.
3, Put the core into LED chip: Chip of LED, like the lamp holder to the light bulb, is power supply parts. “Chip” is one of the import part to achieve ideal effect, because LED’s requirement to the current is extremely high.
4, Package LED chip into illuminant: LED package like add lamp shade to filament and holder to make a light bulb. Shape can be changed according to the requirement.The packaging technology determines the service life of the LED.
5, Lighting applications: Like using incandescent bulb. according to the requirements to assemble different LED products.
For LED lighting, the first three steps of epitaxial wafer, cutting and chip are upstream, the fourth step of encapsulation is middle stream, the application of step 5 is downstream. Want to upgrade work flow, increase LED technology, we need more energy and time to break through.
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